source:Other information release time:2023-03-08 Hits: Popular:PCB Assembly company
From the perspective that is conducive to heat dissipation, the printed version is better installed upright. The distance between the board and the board should not be less than 2cm, and the arrangement method of the device on the printing version should follow certain rules:
1. For equipment that uses free -to -flow air cooling, it is better to arrange integrated circuits (or other devices) in a vertical manner; for equipment that uses forced air cooling Row.
2. The device on the same printing board should be arranged as much as possible according to its heat and heat dissipation level, and devices with small heat or poor heat resistance (such as small signal transistors, small -scale integrated circuits, electrolytic capacitors, etc.) are placed on the place. The upper flow of the cooling airflow (at the entrance), the devices with large heat or good heat resistance (such as power crystal pipes, large -scale integrated circuits, etc.) are placed in the downstream of cooling air.
3. In the horizontal direction, the high -power device should be as close to the edge of the printing board as much as possible in order to shorten the heat transfer path; in the vertical direction, the high -power device is as close to the layout of the printed board to reduce the temperature of other devices during the work of these devices to work. Impact.
4. It is relatively sensitive to the device that is more sensitive to the temperature in areas with relatively low temperature (such as the bottom of the equipment). Do not place it directly above the heating device. Multiple devices are better to staggered on the horizontal plane.
5. The heat dissipation of the printed board in the device mainly depends on air flow. Therefore, the air flow path should be studied when designing, and the device or printing circuit board should be reasonably configured. When the air flows, it always moves to the place where there is less resistance. Therefore, when configured the device on the printing circuit board, avoid leaving a larger airspace in a certain area.
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