source:Other information release time:2024-01-06 Hits: Popular:PCB Assembly company
Wireless infrastructure needs to provide low enough insertion loss to effectively improve energy utilization. With the advent of 4G services, radio frequency products need to provide wider bandwidth and be backward compatible with 3G and 2G services. At the same time, base stations are becoming smaller and lighter, and are installed on the top of towers, which also promotes the development of miniaturization of circuit boards.
In handheld devices such as tablets, many manufacturers are looking for materials that can miniaturize antennas. Handheld devices contain many antennas (Bluetooth, Wi-Fi, cellular communications, GPS, etc.), which are installed in a small space and cannot interfere with each other. At the same time, each company’s antenna design is different and requires flexibility. This places high demands on circuit board materials.
In order to meet the above needs, Rogers developed RO4 3 6 0G2 (RO4 360 second-generation product, which has a higher relative thermal index than the first-generation product) this year. High-frequency circuit board materials, RO4 835 high-frequency circuit board materials, RO470 0JXR series (RO472 5JXR and RO4730JXR) antenna grade laminates and RO3010 high dielectric constant materials and other products. Liu Jianjun, vice president of marketing for Rogers Asia, said: "These products were originally requested by a few customers, but after the products were launched, many customers became interested in them."
Yang Xi, Asia market development manager of Rogers Advanced Circuit Board Materials Division, said that high-frequency boards are widely used and can cover most applications in the market: base station power amplifier design requires the use of high-power, low insertion loss materials; antennas Applications require the board to have a certain hardness and have very good passive intermodulation indicators; automotive applications require the board to have long-term reliability and be able to withstand high temperatures; there are also a wide variety of applications in mobile phones and high-speed circuits.
The power amplifier design attaches great importance to the heat dissipation performance and insertion loss performance of the board. Rogers has a RO3 0 3 5 HTC plate with an insertion loss of 0. 0 0 1 7 and a thermal conductivity of 1.44, which is very suitable for power amplifier applications. Small insertion loss means less heat is generated. Coupled with good thermal conductivity, the heat can be dissipated quickly, thereby reducing the surface temperature of the circuit board and the temperature of the power amplifier tube.
In antenna applications, insertion loss is also important, but more important is the passive intermodulation specification. Rogers' antenna-grade laminates RO4725JXR and RO4730JXR have excellent intermodulation indicators. At the same time, some application scenarios of antennas also require a certain degree of hardness or the design of multi-layer boards. RO470 0JXR series sheets are based on a hydrocarbon resin system, have sufficient hardness, and can be processed and mixed in multiple layers like FR-4 sheets, making them ideal for this type of application.
Automotive radar applications are a rapidly growing field. This year's market has doubled compared with last year and last year compared with the previous year. Automotive applications require high temperature resistance and good long-term reliability. The oxidation resistance of Rogers RO4835 high-frequency circuit board material is ten times that of RO4 3 5 0 B. It can be used for a long time at high temperatures, and the changes in Dk (dielectric constant) and Df (loss tangent) are very limited.
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