+86 13715096176
source:Other information release time:2023-03-13 Hits: Popular:PCB Assembly company
How to improve the uniformity of electroplating and the ability of deep hole plating in PCB manufacturing, and improve the reliability of the board. This depends on the continuous improvement of electroplating process, starting from the proportion of electroplating solution, equipment allocation, operating procedures and other aspects.
The ability of high frequency sound wave to accelerate etching; The permanganate solution can enhance the decontamination ability of the workpiece. The high-frequency acoustic wave will stir and add a certain proportion of potassium permanganate electroplating solution in the electroplating bath. This will help the bath to flow evenly into the hole. So as to improve the deposition ability and uniformity of electroplating copper.
At present, the copper plating and hole filling of blind holes are also mature, which can be used for copper filling of through-holes with different apertures. Two-step copper plating and hole filling can be suitable for through-holes with different apertures and high thickness-diameter ratio. It has strong copper filling capacity and can minimize the thickness of the surface copper layer.
There are many options for the final surface finishing of PCBs, and electroless nickel/gold (ENIG) and electroless nickel/palladium/gold (ENEPIG) are widely used on PCBs.
ENIG and ENEPIG have the same gold dipping process, so it is very important to select the appropriate gold dipping process for the reliable installation and welding or wire connection. There are three types of gold leaching processes: standard replacement gold leaching, high efficiency gold leaching with limited nickel dissolution, and reduction reaction gold leaching with mixed mild reducing agent. The effect of gold leaching by reduction reaction is better.
Read recommendations:
Green Solder Mask FR4 Single Sided PCB Board 0.4mm Halogen Free
Welcome information, we will answer for you quickly