PCB FILM modification_Shenzhen StarLight Industrial Development Co., Ltd.

PCB FILM modification

source:Other information release time:2023-02-09 Hits: Popular:PCB Assembly company: Share:

　　 Multilayer Printed Circuit Board

　　1. indicate Film out of the positive film, negative film:

　　General principles: The thickness of the board is greater than 8mil (non -copper) to take the main film process;

　　The thickness of the board is less than 8mil (non -copper) take the negative film process (thin plate);

　　When the line clearance is large, the copper thickness of D/F needs to be considered instead of the base thickness.

　　Blindly Ring can do 5mil, no need to do 7mil.

　　The inner independent PAD corresponding to the blind hole needs to be retained.

　　Blind holes cannot be done without Ring holes.

　　The buried hole board is consistent with ordinary double -sided circuit boards.

　　The blind hole board, that is, one side is the outer layer:

　　Positive process: You need to do single -sided D/F, be careful not to get the wrong surface (when the two -sided bottom copper is inconsistent); when D/F is exposed, the light copper surface is covered with vinyl belt to prevent light transmission.

　　Because the blind hole board does more than two panels, the map is very easy to be thick and thick. Therefore, the graphic power control controls the thick copper thickness, and the scope of the copper thick plate is indicated after etching.

　　After pressing the board, use the X-RAY machine to use a multi-layer board to use the target hole.

　　Negative film process: For thin plates (<12mil Copper ", because they cannot produce in Tu Dianli, they must be produced in Shuijin La, and Water Jinla cannot be available to the current. Small current. If you take the main film process, you often cause single -sided copper thickness, causing erosion difficulty, and the phenomenon of young lines. Therefore, such boards need to take a negative film process.

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