source:Other information release time:2022-11-24 Hits: Popular:PCB Assembly company
"Cleaning" is often ignored in PCBA manufacturing of circuit boards (circuit boards), and cleaning is not considered a critical step. However, with the long-term use of the product on the client side, the problems caused by the previous invalid cleaning caused many failures, and the operating costs caused by repairing or recalling the product increased dramatically. Next, we will learn about the role of PCBA cleaning on circuit boards (circuit boards) with you.
PCBA (Printed Circuit Component) production process goes through several process stages, each stage is polluted to varying degrees, so there are various sediments or impurities left on the PCBA surface of the circuit board (printed circuit board), which can reduce product performance and even cause product failure. For example, solder paste and flux are used to assist the welding of electronic components. Residues are generated after welding. These residues contain organic acids and ions, which can corrode PCBA of circuit boards (circuit boards). The presence of ions may cause short circuit and product failure.
There are many kinds of pollutants on PCBA, which can be divided into two categories: ionic and non-ionic. Ionic pollutants, when exposed to moisture in the environment, undergo electrochemical migration after being powered on, forming dendritic structures, resulting in low resistance paths and destroying the PCBA function of the circuit board (circuit board). Non-ionic pollutants can penetrate the insulation layer of PCB and grow dendrites under the surface layer of PCB plates. In addition to ionic and non-ionic pollutants, there are also granular pollutants, such as solder balls, floating points in solder grooves, dust, dust, etc. These pollutants can lead to many adverse phenomena such as reduced quality of solder joints, tip-pulling of solder joints during welding, pore generation, short circuit, etc.
With so many pollutants, which ones are the most concerned? Solder AIDS or solder pastes are widely used in reflux and peak welding processes. They are mainly composed of solvents, wetting agents, resins, corrosion inhibitors and activators. Thermal modification products must exist after welding. These substances dominate in all pollutants. From the point of product failure, residual after welding is the most important factor affecting product quality. Ionic residues are prone to cause electromigration and reduce insulation resistance. Residues of rosin resin are easy to absorb dust or impurities, which leads to increased contact resistance, which leads to open circuit failure. Therefore, strict cleaning after welding is necessary to ensure the quality of PCBA in the circuit board (circuit board).
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