PCB's COB and packaging processrigid flex pcb stackup_Shenzhen StarLight Industrial Development Co., Ltd.

PCB's COB and packaging processrigid flex pcb stackup

source:Other information release time:2023-07-18 Hits: Popular:PCB Assembly company: Share:

　　In addition to packaging the chip and the outside world isolation and protection, there is also a circuit connection.

　　The standard packaging form is limited, and the number of pins is also standard. This means that if an additional electrical connection is required, a larger package must be selected, which will inevitably increase the size and cost of the package.

　　More than 100 pins chip generally requires high packaging. Sometimes the geometric size of the packaging brings many difficulties to the key, causing damage to the chip. The special integrated circuit ASIC is usually small -scale production, which increases the difficulty of choosing the corresponding packaging. But the biggest difficulty is how to meet the requirements of the special packaging as much as possible.

　　The use of the current technology to be designed in a very short time to achieve a large number of interconnection. Today COB technology can provide a satisfactory solution for it.

　　In a very small amount of processing costs, a large amount of chip connection and interconnection can be correctly resolved. After the lead key is completed, the circuit chip and all the key lead are packed in the above process. For small batch ASIC components that require intellectual property protection, it cannot be easily copied, which provides advantages. And the passive device and other chips can also be integrated in the same packaging.

　　The advantages of the COB packaging method are first of all the packaging volume, and the standard packaging size is often 10 times that of the chip. Second, the cost of the standard packaging of ASIC is often much larger than that of the chip itself.

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