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High difficulty PCB products.led flex pcb board

source:Other information release time:2023-07-21 Hits:     Popular:PCB Assembly company

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  In 2003, flexible printed circuit boards reached their peak, but were subsequently in a sluggish state for three consecutive years. However, in 2007, multi-layer flexible printed circuit boards increased by 30.6% compared to last year, and the entire flexible printed circuit board increased by 6.2% compared to last year. The high growth rate of multi-layer flexible printed circuit boards indicates an increasing trend towards high-density development in the target market. This requires not only ensuring a stable supply of materials used, but also continuous technological development and progress. In 2007, although the module substrate did not reach the growth rate of last year, it still maintained the demand for IC packaging substrates such as logic or storage and chip installation combinations. Overall, the module substrate increased by 9.8% compared to last year, reaching 539.81 billion yen, climbing the 500 billion yen level, accounting for 39.1% of the total output value of printed circuit boards (37.4% in 2006 and 38% in 2005). The total output value of all printed circuits accounts for nearly 40%. We have achieved the goal of significant and rapid growth. Module substrates are different from printed circuit boards and are monopolized by a limited number of manufacturing factories. Even in the world, Japanese module substrate manufacturers have the strongest competitiveness. Due to the fact that the majority of module substrate customers are overseas, this is the main reason for the good export situation. The multi-layer printed circuit board market has steadily expanded year by year and is gradually penetrating into the multi-layer board market. In 2007, there was also a significant increase, an increase of 20.5% compared to last year, reaching a scale of 446.5 billion yen. Especially with the obvious layering of modular substrates, the output value in 2007 increased from 228.7 billion yen in 2006 to 294.4 billion yen. In this context, considering that electronic products will have a stronger demand for high-density circuit boards, the result will inevitably be a concentration of difficult new technologies towards some monopolistic manufacturers. It is expected that the output value of electronic circuit substrates will reach 1393.8 billion yen in 2008. In 2008, the output value of epoxy resin printed circuit boards (PCBs) in Japan increased by 1.0% compared to its actual performance in 2007, reaching 1393.8 billion yen; Since the slowdown of the economic situation in the second half of 2007, the world's economic situation has also retreated. It is reasonable and appropriate to doubt whether 2008 can fully recover from the floating state. In the first half of 2007, the total production revenue of epoxy resin printed circuit boards (PCBs) in Japan was 494.9 billion yen (approximately 4.3 billion US dollars), an increase of 8.6% compared to the same period last year; The total production decreased by 1.4% compared to the same period last year, to 12.17 million square meters. This leads to an increase in revenue and a decrease in production. In the first half of 2006, managers in the epoxy resin printed circuit board (PCB) industry in Japan gradually shifted their focus to high-priced products to increase profits; This business plan was also continued in the second half of 2006. This trend still existed in early 2007. Manufacturers achieved double-digit growth in revenue, but production decreased by over 5%. In the past few months, Japanese manufacturers have shifted their development direction, focusing on increasing production and being willing to maintain market share at the cost of profits. Japanese manufacturers have adopted different Marketing strategy for each product category, especially in flexible circuits. Due to the high prices of double-sided and multi-layer circuits, manufacturers have gradually shifted from operating single-sided circuits to operating double-sided and multi-layer circuit boards.


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