PCB OSP process.Polymer Film Flex PCB Board Factory_Shenzhen StarLight Industrial Development Co., Ltd.

PCB OSP process.Polymer Film Flex PCB Board Factory

source:Other information release time:2023-06-13 Hits: Popular:PCB Assembly company: Share:

　　Organic soldering film, because it is an organic substance, not a metal, is even cheaper than the tin spraying process.

　　Its advantages and disadvantages are

　　Advantages: It has all the advantages of bare copper plate welding, and expired boards can also undergo a new surface treatment.

　　Disadvantage: Easily affected by acid and humidity. When used for secondary reflow soldering, it needs to be completed within a certain period of time, and the effect of the second reflow soldering is usually poor. If the storage time exceeds three months, a new surface treatment must be carried out. After opening the packaging, it needs to be used up within 24 hours. OSP is an insulating layer, so the Test point must be printed with solder paste to remove the original OSP layer before contacting the pin point for electrical test.

　　The only function of this organic thin film is to ensure that the inner copper foil is not oxidized before welding. When heated during welding, this layer of film evaporates. Soldering can solder copper wires and components together.

　　But it is not corrosion-resistant. An OSP circuit board that has been exposed to air for about ten days cannot be soldered with components.

　　Many computer motherboards use OSP technology. Because the area of the circuit board is too large, gold plating cannot be used.

Read recommendations:

Single Sided PCB

Multilayer Printed Circuit Board

1.5oz Multilayer Pcb Fabrication FR4 Printed Circuit Board Pcb 4 Layer