PCB Drilling and Sinking Copper_Shenzhen StarLight Industrial Development Co., Ltd.

PCB Drilling and Sinking Copper

source:Other information release time:2023-02-03 Hits: Popular:PCB Assembly company: Share:

　　 Multilayer Printed Circuit Board

　　1. Objective: The metallization of the holes will be penetrated.

　　① The substrate proofing of the circuit board is composed of copper foil, glass fiber, and epoxy resin. During the production process, the cross -section of the hole wall of the base material is composed of the above three parts of the material.

　　② Pole metalization is to solve the metal copper covered with a uniform layer of uniform, heat -resistant shock on the section. Pole metalization is to solve the metal copper covered with a uniform layer of uniform layer on the cross section.

　　③ The process is divided into three parts: one drilling process, two chemical copper processes, and three thick copper processes (all board electroplated copper).

　　Shen copper and thick copper

　　The metal of the hole involves a concept of ability, thick diameter ratio. The thick diameter ratio is the ratio of the thickness of the plate to the aperture. , Thick diameter ratio. The thick diameter ratio is the ratio of the thickness of the plate to the aperture. When the board continues to thicken and the pores are constantly decreased, the chemical YAO water is becoming more and more difficult to enter the depth of the drilling. Although the electroplating equipment uses vibration, pressure, etc. The central plating is still thin. At this time, the drilling layer will be slightly open. When the voltage increases and the board is impacted under various bad conditions, the defect is completely exposed, causing the lines of the board to disconnect and cannot complete the specified work.

　　Therefore, the designer needs to understand the process capabilities of the circuit board manufacturer in a timely manner, otherwise it will be difficult to achieve the PCB circuit board designed. It should be noted that the thick diameter than this parameter must not only be considered when designing through the hole, but also needs to be considered when the blind burial design.

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