The reason for the problem of bubbling on the line board.Immersion Gold Single Sided Copper Clad Board distributors_Shenzhen StarLight Industrial Development Co., Ltd.

The reason for the problem of bubbling on the line board.Immersion Gold Single Sided Copper Clad Board distributors

source:Other information release time:2023-04-12 Hits: Popular:PCB Assembly company: Share:

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　　PCB line board surface foaming is actually a problem of poorly binding power, and then extended the surface quality problem of the plate surface. This includes two aspects:

　　The problem of cleanliness of the plate surface; 2. The problem of micro -roughness (or surface energy) on the surface.

　　The problem of foaming on the board surface on all circuit boards can be summarized as the above reasons.

　　Poor binding force between plating layers is too low, and it is difficult to resist the coating stress, mechanical stress and thermal stress, etc. in the process of subsequent production and processing process and assembly process, which ultimately causes different degrees of separation between plating.

　　The reason for the problem of bubbling on the line board

　　Some factors that may cause the quality of the plate surface in the process of production and processing may be summarized as follows:

　　Problems of substrate processing:

　　Especially for some thinner substrates (generally less than 0.8mm), because the substrate is poor in rigidity, it is not advisable to use a brush machine brush board.

　　This may not be able to effectively remove the protective layer that is specially treated in the production and processing process of the substrate to prevent the copper foil of the plate surface. Although the layer is thinner and the brush board is easier to remove, there are great difficulties to use chemical treatment. Pay attention to control of processing, so as to avoid causing the problem of bubbles caused by poor combination between the copper foil and chemical copper of the plate surface of the surface; when this problem is blackened in the inner layer of the thin Bad, uneven color, and local black brown into the problem.

　　2. The phenomenon of oil pollution or other liquids caused by the process of processing (drilling, layer pressure, milling, etc.) on the surface of the plate surface is poorly treated with the surface treatment of dust pollution.

　　3. Smart copper brush board is poor:

　　The pressure of the front grinding plate in front of the sinking copper is too large, causing the pore deformation to brush out the copper foil rounded corner of the hole and even the pore outlet leakage substrate. The board does not cause a leakage material, but the excessive brush board will increase the roughness of the copper of the pores. Therefore, during the process of micro -erosion and roughness, the copper foil is very easy to cause too much excessive phenomenon. Hidden dangers; therefore, pay attention to strengthening the control of the brush board process. You can adjust the brush process parameters to the best politics through the grinding test and water film test;

　　4. Washing problem:

　　Because sinking copper electroplating should be treated with a large amount of chemical potion, there are many drug solvents such as various types of pH and non -pole organic, and the surface of the plate surface is not clean. The local processing of the plate surface is poor or the processing effect is poor, and the defects of unevenness cause some problems in combination; therefore, we must pay attention to strengthening the control of water washing, mainly including cleaning water flow, water quality, water washing time, and dripping water. Control in time and other aspects; special winter temperatures are low, and the water washing effect will be greatly reduced. It is also necessary to pay attention to the control of strong water washing;

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