Introduction to PCB proofing production process_Shenzhen StarLight Industrial Development Co., Ltd.

Introduction to PCB proofing production process

source:Other information release time:2023-02-02 Hits: Popular:PCB Assembly company: Share:

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　　1、 Contact the manufacturer

　　First, you need to find the PCB manufacturer on the Internet, and then find out the company size, product advantages, and address of the PCB manufacturer. Then you can communicate (QQ or call), and there will be relevant personnel to quote for you, place an order, and follow up the production progress, shipment, and delivery.

　　2、 Material opening

　　Purpose: According to the requirements of the engineering data MI, cut the large plates that meet the requirements into small pieces for production. Small plates that meet customer requirements

　　Process: large plate → plate cutting according to MI requirements → curium plate → beer fillet edge grinding → plate out

　　3、 Drilling

　　Purpose: According to the engineering data, drill the required hole diameter at the corresponding position on the sheet metal with the required size

　　Process: laminated pin → upper plate → drilling → lower plate → inspection/repair

　　4、 Copperplate

　　Purpose: Copper deposition is to deposit a thin layer of copper on the wall of insulating hole by chemical method

　　Process: rough grinding → hanging plate → automatic copper deposition line → lower plate → dipping% dilute H2SO4 → thickening copper

　　5、 Graphic transfer

　　Purpose: Graphic transfer is to transfer the image on the production film to the board

　　Process: (blue oil process): plate grinding → printing the first side → drying → printing the second side → drying → lighting → developing → inspection; (Dry film process): hemp board → pressing film → standing → alignment → exposure → standing → developing → inspection

　　6、 Graphic electroplating

　　Purpose: Pattern electroplating refers to electroplating a copper layer with the required thickness and a gold nickel or tin layer with the required thickness on the exposed copper skin or hole wall of the circuit pattern

　　Process: upper plate → degreasing → secondary water washing → micro etching → water washing → pickling → copper plating → water washing → pickling → tin plating → water washing → lower plate

　　7、 Demembrane

　　Purpose: Remove the anti electroplating coating with NaOH solution to expose the non circuit copper layer

　　Process: water film: rack inserting → alkali dipping → flushing → scrubbing → machine passing; Dry film: plate placing → machine passing

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