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Why does PCB generally do not need to "spray tin"?

source:Other information release time:2023-02-15 Hits:     Popular:PCB Assembly company

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  Multilayer Printed Circuit Board

  As IC's integration becomes higher and higher, the more IC feet are dense. The vertical tin spraying process is difficult to flatten the pads of the finely, which brings difficulty to the SMT's paste; in addition, the desklife life of the tin plate is short. The gold -plated board just solved these problems:

  1. For surface stickers, especially for 0603 and 0402 ultra -small table stickers, because the flatness of the pads is directly related to the quality of the printing process of the tin paste, it has a decisive impact on the subsequent re -welding quality. Global is often seen in high -density and super small table stickers. 2 During the trial stages, the influence of factors such as component procurement is often not welded immediately when the board comes, but often wait for a few weeks or even a month to use it. combine

  There are many times of gold long, so everyone is willing to use it. Besides, the cost of gold -plated PCB in the sample stage is almost the same as that of lead -tin alloy boards.

  But as the wiring becomes more and more dense, the width and spacing have reached 3-4mil. Therefore, the problem of short -circuit gold silk

  As the frequency of the signal becomes higher and higher, the impact of the effect of transmission transmission in a multi -plated layer due to the skin tendency effect, the more obvious the impact of the signal quality

  The skin tendency effect refers to: high -frequency AC power, the current will be concentrated on the surface of the wire.

  According to calculations, the depth of the skin is related to the frequency

  Other disadvantages of gold -plated boards are listed in the difference between the golden board and the gold -plated board.

  Why choose the golden board and do not choose the gold -plated board?


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