Difference between HDI board and blind buried hole circuit board_Shenzhen StarLight Industrial Development Co., Ltd.

Difference between HDI board and blind buried hole circuit board

source:Other information release time:2022-12-08 Hits: Popular:PCB Assembly company: Share:

　　 Multilayer Printed Circuit Board

　　HDI is a product of circuit board, which is called highDensityInterconnection. At present, high-order electronic products are generally HDI board products.

　　Blindvias: Blind holes are vias that connect the inner layer routing of a PCB with the surface layer routing of a PCB. This hole does not penetrate the entire board.

　　Buried vias: Buried vias only connect the via type of wiring between inner layers, so they cannot be seen from the PCB surface.

　　With the development of portable product design towards miniaturization and high-density, PCB design is becoming more and more difficult, which puts forward higher requirements for PCB production process. At present, in most portable products, BGA packaging with a spacing of less than 0.65mm has used the design process of blind buried hole, so what is blind buried hole?

　　Blindvias: Blindvias are vias that connect PCB inner layer routing with PCB surface layer routing. This hole does not penetrate the whole board.

　　Buried vias: Buried vias only connect the via type of wiring between inner layers, so they cannot be seen from the PCB surface.

　　The circuit board with buried blind holes is not necessarily HDI circuit board, but generally HDI boards have blind holes, so the buried holes are not necessarily. It depends on the level and pressure of your circuit board product.

　　The description is as follows:

　　The first and second order of 6-layer circuit boards are for boards that need laser drilling, namely HDI boards

　　First order HDI board of 6-layer circuit board refers to blind holes: 1-2,2-5,5-6. That is, 1-2,5-6 needs laser drilling

　　Second order HDI board of 6-layer circuit board refers to blind holes: 1-2,2-3, 3-4, 4-5, 5-6. That is, two laser drilling is required

　　First drill 3-4 buried holes, then press 2-5, then drill 2-3, 4-5 laser holes for the first time, then press 1-6 for the second time, then drill 1-2, 5-6 laser holes for the second time, and finally drill through the hole. It can be seen that the second order HDI plate has been pressed twice and laser drilled twice

　　In addition, the second order HDI board is also divided into staggered hole second order HDI board and stacked hole second order HDI board. The staggered hole second order HDI board means that the blind holes 1-2 and 2-3 are staggered, while the stacked hole second order HDI board means that the blind holes 1-2 and 2-3 are stacked together, for example: blind: 1-3, 3-4, 4-6

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