PCB plate occurs when plating in dry membranes_Shenzhen StarLight Industrial Development Co., Ltd.

PCB plate occurs when plating in dry membranes

source:Other information release time:2023-02-11 Hits: Popular:PCB Assembly company: Share:

　　The reason why the seepage is infiltrated, indicating that the dry membrane and the copper -covered foil panel cannot be bonded firmly, causing the plating fluid to deepen, causing the "negative phase" part of the coating to become thicker. Most PCB manufacturers are caused by the following points:

　　1. The exposure energy is high or low

　　Under the ultraviolet light, the light -induced agent that absorbs the light energy is decomposed into a free base and caused a single -polymerization reaction to form a body molecules that insolublely dilute -alkali solutions. When the exposure is insufficient, due to the incomplete aggregation, the glue membrane is softened during the development process, resulting in unclear lines or even the membrane layer falling off, resulting in poor combination of membrane and copper. In the middle of the ups and downs, forming an osmotic plating. Therefore, it is important to control the exposure energy.

　　2. The film pressure is high or low

　　When the film pressure is too low, it may cause unevenness of the film surface or the gap between the gap between the dry film and the copper plate to meet the combination force; if the film pressure is too high, the solvent and volatile components of the resistance layer can be too volatile, causing the. The dry membrane becomes crispy, and the electroplating will be stripped after the electroplating.

　　3. The film temperature is high or low

　　If the temperature of the film is too low, because the resistance film does not get sufficient softening and appropriate flow, the surface of the dry membrane and the surface of the copper foil layer is poor; The rapid volatilization of the substance produces bubbles, and the dry membrane becomes crispy. During the electroplating and electrical shock, it forms a till peeling, causing seepage.

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