source:Other information release time:2023-03-16 Hits: Popular:PCB Assembly company
1. The less the lead between the tube of the high -speed electronic component, the less the bending, the better
The leader of the high -frequency circuit wiring is best to adopt a full line, which needs to be turned. You can use a 45 -degree fold line or an arc to turn. This requirement is only used to increase the firmness of copper foil in the low -frequency circuit. One requirement can reduce the transmission of high -frequency signals and coupling between each other.
Second, the less the lead layer between the tube of the high -frequency circuit device is better, the better
The so -called "less intervals of the lead, the better" is the less holes (VIA) used in the component connection process. A pores can bring about 0.5PF distributed capacitors. Reducing the number of over -holes can significantly increase the possibility of speed and reduce data errors.
3. The shorter the lead between the tube of the high -frequency circuit device, the better
The radiation intensity of the signal is directly proportional to the length of the signal line. The longer the high -frequency signal lead, the easier it is to couple on the components close to it. The LVDS line, USB line, HDMI line and other high -frequency signal lines all require as short as possible as possible.
Fourth, the power pins of the integrated circuit block increase the high -frequency retreat capacitor
The power pin of each integrated circuit block increases a high -frequency retreating capacitor nearby. Increasing the high -frequency retinal capacitor with power pins can effectively suppress high -frequency harmonic on the feet of the power supply to form interference.
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