What is the cause of PCB line board surface foaming?_Shenzhen StarLight Industrial Development Co., Ltd.

What is the cause of PCB line board surface foaming?

source:Other information release time:2023-02-07 Hits: Popular:PCB Assembly company: Share:

　　1. The problem of the process of PCB substrate process:

　　Especially for some thinner substrates (generally less than 0.8mm), because the rigidity of the substrate is poor, it is not advisable to use the brush machine brush board.

　　This may not be able to effectively remove the protective layer that is specially treated in the production and processing of the substrate to prevent the copper foil of the board. Although the layer is thinner and the brush board is easier to remove, there are great difficulties to use chemical treatment. Pay attention to control of processing, so as not to cause the problem of bubbles caused by poor combination between the copper foil and chemical copper of the plate surface of the surface; when this problem is blackened in the thinner layer, there will also be blackened brownization. Bad, uneven color, and local black brown into the problem.

　　2. Circuit board surfaces The phenomenon of oil pollution or other liquids caused by the process of oil or other liquids caused by the process of processing (drilling, layer pressure, milling, etc.).

　　3. Poor returns to the copper:

　　Some sinking copper or graphic rework boards due to poorly plating during the rework process, incorrect rework methods or improperly controlling time control in the process of rework, or other reasons, or other reasons, will cause the surface of the board to bubble; Poor sinking copper can be used to pick up directly from the line after washing through the water without erosion; it is best not to remove the oil and erosion again; for the plate that has been thickened by the board, it should be placed in a slight erosion slot now. Pay attention to time control, you can use one or two plates to roughly calculate the fading time to ensure the fading effect; after the fading is completed, the brush machine is used for a set of soft milling brushes and then according to the normal production process. The erosion time should be halved or the necessary adjustment;

　　4. Washing problem:

　　Because sinking copper electroplating should be treated with a large amount of chemical potion, there are many drug solvents such as various types of pH, and non -washing, and the surface of the plate surface is not clean. The local processing of the plate surface is poor or the processing effect is poor, and the defects of unevenness cause some problems in combination; therefore, we must pay attention to strengthening the control of water washing, mainly including cleaning water flow, water quality, water washing time, and dripping water. Control in time and other aspects; special winter temperatures are low, and the water washing effect will be greatly reduced. It is also necessary to pay attention to the control of strong water washing;

　　5. Smart copper brush board is poor:

　　The pressure of the grinding plate in front of the sinking copper is too large, causing the pore deformation to brush out the copper foil rounded corner of the hole or even the pores leakage substrate. The board does not cause the leakage material, but the overweight brush board will increase the roughness of the copper of the pores. Therefore, during the process of micro -erosion and roughness, the copper foil is very easy to produce too much. Hidden dangers; therefore, we must pay attention to strengthening the control of the brush board process. You can adjust the brush process parameters to the best politics through milling test and water film test;

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