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Discussion on Early Packaging of PCB.HASL OSP Multi Layer Pcb Board

source:Other information release time:2023-08-14 Hits:     Popular:PCB Assembly company

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  The early packaging methods, such as outdated shipping packaging methods, are listed in detail. Currently, some small factories still use these methods for packaging.

  The domestic PCB production capacity is expanding rapidly, and most of it is exported, so the competition is very fierce. Not only is there competition among domestic factories, but also with the top two PCB factories in the United States and Japan. In addition to the technical level and quality of the products being recognized by customers, the quality of packaging also needs to be satisfied by customers. Almost small-scale electronic factories now require PCB manufacturers to pay attention to the following items when shipping packaging, and some even directly provide specifications for shipping packaging.

  1. Must be vacuum packaged

  2. The number of boards in each stack is limited based on the size being too small

  3. Specifications for the density of each layer of PE adhesive film and regulations for the width of the reserved edge

  4. Specification requirements for PE film and Air Bubble Sheet

  5. Carton weight specifications and others


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