PCB composite plating can be divided into the following three types according to the difference in deposition._Shenzhen StarLight Industrial Development Co., Ltd.

PCB composite plating can be divided into the following three types according to the difference in deposition.

source:Other information release time:2023-06-15 Hits: Popular:PCB Assembly company: Share:

　　(1) The particles are scattered with particles so that they are suspended in the plating solution for electrical or chemical deposition. This method is called a diffuse deposition method.

　　(2) When the particles are large or heavy, let the particles deposit on the surface of the matrix first, and then use the precipitated metal to fill the particle gap. This method is called the deposition common analysis method.

　　(3) Equal long fiber buried or rolled on the surface of the substrate for deposition. This method is called buried deposits.

　　Get used to the first two methods as composite plating, and the latter method is called fiber reinforcement composite plating.

　　The process of composite plating is the organic combination of physical and chemical processes. It is generally believed that when the composite composite plating, the particles and metal deposition process divided into the particles in the plating solution are transported near the cathode surface, the particles are adsorbed on the surface of the metal plating, the metal ions discharge on the cathode surface to form a lattice and bury the solid particles to bury the solid particles Several steps in the metal layer. The coexistence of particles forms irregular distribution in the sedimentary metal. In the composite plating of fibrous fiber, the curly long fiber presents a regular arrangement. Chemical plating can also prepare high -quality composite coating.

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