source:Other information release time:2023-10-23 Hits: Popular:PCB Assembly company
PCB has developed from single-layer to multi-layer circuit boards, and still maintains their respective development trends. Due to the continuous development towards high precision, high density and high reliability, the continuous reduction of volume, cost reduction and performance improvement, printed boards still maintain strong vitality in the development of future electronic equipment. After electronic equipment uses printed boards, due to the consistency of similar printed boards, manual wiring errors are avoided, and electronic components can be automatically inserted or mounted, soldered, and inspected to ensure the quality of electronic equipment. , improve labor productivity, reduce costs, and facilitate maintenance.
PCB board material:
22F single-sided composite substrate: single-sided semi-glass fiber board. (Generally, it can be die punched, if the requirements are high, computer drilling can be used)
CEM-1 Single Sided Composite Substrate: This material requires CNC drilling. (Generally, it can be die punched, if the requirements are high, computer drilling can be used)
CEM-3 double-sided composite substrate: the lowest and low-end double-sided material, which is semi-glass fiber material. (Except for double-sided cardboard, it is the lowest-end material for double-sided panels. Simple double-sided panels can use this material, which is about 5-10 yuan/㎡ cheaper than FR-4).
FR-4 epoxy fiberglass board: the most commonly used material for PCB circuit boards (PCB multi-layer circuit board factories).
Multilayer PCB circuit board/gold finger circuit board
PCB board fire protection grade classification: According to the UL standard, the combustion characteristics of the substrate can be divided into the following four categories from high to low: UL-94V0, UL-94V1, UL-94V2, and UL-94HB.
Pre-cured sheet: used to make multi-layer PCB boards. Commonly used models include 1080, 2116, 7628 and other specifications.
94HB cardboard: The most common cardboard material, basically used to make low-grade single panels, cheap. Because it is not flame retardant, it cannot be used for a series of products with fire protection requirements such as power supplies.
94V0 cardboard: a cardboard material with flame retardant effect. Compared with 94HB cardboard material, its composition has flame retardant added. (die punching)
Summarizing the domestic and foreign discussions on the future development trends of printed circuit board manufacturing technology are basically consistent, that is, towards high density, high precision, fine aperture, fine wires, fine spacing, high reliability, multi-layering, high-speed transmission, and lightweight , develop in the direction of thinness, and simultaneously develop in the direction of improving productivity, reducing costs, reducing pollution, and adapting to multi-variety and small batch production. The technological development level of printed circuits is generally represented by the line width, aperture, and board thickness/aperture ratio on the printed circuit board.
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