PCB thermal design from the perspective that is conducive to heat dissipation_Shenzhen StarLight Industrial Development Co., Ltd.

PCB thermal design from the perspective that is conducive to heat dissipation

source:Other information release time:2023-02-14 Hits: Popular:PCB Assembly company: Share:

　　The printed version is better installed upright. The distance between the board and the board should not be less than 2cm, and the arrangement method of the device on the printing version should follow certain rules:

　　For equipment that uses free -to -flow air cooling, it is better to arrange integrated circuits (or other devices) in a vertical manner;

　　For equipment that uses strong air cooling, it is better to arrange integrated circuits (or other devices) in a long way;

　　The device on the same printing board should be arranged as much as possible according to its heat and heat dissipation level. Device with a small heat or poor heat resistance (such as small signal transistors, small -scale integrated circuits, electrolytic capacitors, etc.) are placed in cooling airflow Comparison (at the entrance), devices (such as power transistors, large -scale integrated circuits, etc.) with large heat or heat resistance (such as power crystal pipes, large -scale integrated circuits, etc.)

　　In the horizontal direction, the high -power device is as close to the edge of the printed board as much as possible in order to shorten the heat transfer path;

　　In the vertical direction, the high -power device is as close to the layout of the printed board to reduce the effect of the temperature of these devices on the temperature of other devices;

　　The device that is more sensitive to temperature is relatively easy to place in areas with relatively low temperature (such as the bottom of the equipment). Do not place it directly above the heating device. Multiple devices are better on the horizontal plane.

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