What are the main raw materials for FPC.flexible pcb board material_Shenzhen StarLight Industrial Development Co., Ltd.

What are the main raw materials for FPC.flexible pcb board material

source:Other information release time:2023-08-18 Hits: Popular:PCB Assembly company: Share:

　　Everyone should have a good understanding of the characteristics of FPC circuit boards, such as small size and light weight, which can be used in precision small electronic equipment applications; It can be bent or bent, and can be used to install any geometric shape equipment body, and so on. So why do FPC circuit boards have these characteristics? Today, the editor of PCB circuit board manufacturers will introduce the main raw materials of FPC to everyone.

　　The main raw materials include: 1. substrate, 2. covering film, 3. reinforcement, and 4. other auxiliary materials.

　　1. Substrate

　　1.1 Adhesive substrate

　　The adhesive substrate mainly consists of three parts: copper foil, adhesive, and PI. There are two types of substrates: single-sided substrate and double-sided substrate. Materials with only one copper foil are single-sided substrates, while materials with two copper foils are double-sided substrates.

　　1.2 Adhesive free substrate

　　Non adhesive substrate refers to a substrate without an adhesive layer. Compared to ordinary adhesive substrate, it has fewer intermediate adhesive layers and only consists of copper foil and PI. Compared to adhesive substrate, it has thinner, better dimensional stability, higher heat resistance, higher bending resistance, and better chemical resistance, and is now widely used.

　　2. Covering film

　　It mainly consists of three parts: release paper, adhesive, and PI, and then remains on the product with only two parts: adhesive and PI. The release paper will be torn off during the production process and will no longer be used (its function is to protect foreign objects on the adhesive).

　　3. Reinforcement

　　Used as a specific material for FPC, in a specific part of the product to increase support strength and compensate for the "soft" nature of FPC.

　　There are currently several commonly used reinforcement materials:

　　1) FR4 reinforcement: The main components are glass fiber cloth and epoxy resin adhesive, which are the same as the FR4 material used in PCB;

　　2) Steel reinforcement: composed of steel, with strong hardness and support strength;

　　3) PI reinforcement: Same as the covering film, it consists of three parts: PI and adhesive release paper, but its PI layer is thicker and can be produced in a ratio from 2 MIL to 9 MIL.

Read recommendations:

Multilayer Printed Circuit Board

Polymer Film Flex PCB Board 0.1mm 2 Layer Rigid Flex Pcb Lightweight

Multilayer Printed Circuit Board 1OZ 4 Layer Multilayer Pcb FR4 TG170 Blue Solder Mask