source:Other information release time:2023-07-13 Hits: Popular:PCB Assembly company
The distribution of glue is another complex process that easily deviates from the desired results. Like the tin paste printing, it is necessary to be a clear and appropriate process monitoring strategy to maintain the control of this process. It is recommended to check the diameter of the glue point. Record the results using the X-Bar R Chart to record the results.
Before and after a glue cycle, drip at least two isolated glue points on the plate to represent each point in a good idea. This allows operators to compare the quality of the glue during the cycle of Emperor Plastic. These points can also be used to measure the diameter of the glue point. The glue check tool is relatively not expensive, and basically there are portable or desktop measurement microscopes. I don't know if there is any automatic device designed for glue check. Some automatic optical inspection (AOI, Automated Optical Inspection) machines can adjust it to complete this task, but it may be large and small.
The initial product confirmation. The company usually checks the first board from the loading line to confirm the setting of the machine. This method is slow, passive and not accurate. A complex board contains at least 1,000 components, and many are not marked (value, part number, etc.). This makes it difficult to check. Verifying machine settings (components, machine parameters, etc.) is a positive method. AOI can be effectively used for the first board check. Some hardware and software suppliers also provide the feeder settings to confirm the software.
Coordinating the verification of the machine setting is an ideal role of a process monitor. He uses a checklist to help the machine operator confirm the process through the production line. In addition to the setting of the feeder, the process monitor should use the existing tools to carefully check the original two boards. After the return welding, the process monitor should conduct fast but detailed inspections of key components (dense spacing elements, BGA, polar capacitors, etc.). At the same time, the production line continues to assemble boards. In order to reduce the shutdown time, the production line should be filled before the return of the two boards after the process monitor inspects the first two returns. This may be a bit dangerous, but you can get confidence in doing so by verifying the machine setting.
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