source:Other information release time:2023-09-15 Hits: Popular:PCB Assembly company
Aluminum substrate is a metal based copper clad plate with good heat dissipation function. Below, let's learn about the classification of PCB aluminum substrates.
1、 Flexible aluminum substrate
One of the latest developments in IMS materials is flexible dielectrics. These materials can provide excellent electrical insulation, flexibility, and thermal conductivity. When applied to flexible aluminum materials, products can be formed to achieve various shapes and angles, which can eliminate expensive fixing devices, cables, and connectors.
2、 Mixed aluminum aluminum substrate
The most common is a 2-layer or 4-layer sub component made of traditional FR-4, which can be bonded to an aluminum substrate with a thermoelectric medium to aid in heat dissipation, improve rigidity, and serve as a shield.
3、 Multilayer aluminum substrate
In the high-performance power supply market, multi-layer IMSPCB is made of multi-layer thermal conductive dielectrics. These structures have one or more layers of circuits embedded in the dielectric, with blind holes used as thermal through holes or signal pathways.
4、 Through-hole aluminum substrate
In the most complex structure, a layer of aluminum can form a "core" of a multi-layer thermal structure. Before lamination, aluminum is pre plated and filled with dielectric. Thermal materials or sub components can be laminated onto both sides of aluminum using thermal adhesive materials. Once laminated, the completed components are similar to traditional multi-layer aluminum substrates through drilling. Electroplated through holes pass through gaps in aluminum to maintain electrical insulation.
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