source:Other information release time:2023-08-19 Hits: Popular:PCB Assembly company
During the process of circuit board sampling, gold deposition and plating are widely used in surface treatment processes; The fundamental difference between them is that gilding is hard gold, while sinking gold is soft gold. So, what is the difference between surface treatment of circuit boards with gold deposition and gold plating?
1. The crystal structure formed by depositing gold and gilding is different, and the thickness of depositing gold is much thicker than that of gilding; Sinking gold will turn golden yellow, more yellow than gilding.
2. Sinking gold is easier to weld than plating gold, and it will not cause poor welding. The stress of the sinking plate is easy to control. Meanwhile, due to the softness of sinking gold compared to gilding, gilded gold fingers are more difficult to wear.
3. The solder pad of the sunken board only has nickel gold, and the skin effect of the signal is transmitted on the copper layer, which will not affect the signal.
4. The crystal structure of precipitated gold is denser than that of plated gold, and it is less prone to oxidation.
5. Plating can easily short-circuit the gold wire; There is only nickel gold on the solder pad of sinking gold, so it is not easy to produce gold wire short circuits.
6. The combination of the resistance of the gold plate wire and the copper layer is more firm.
7. The gold sinking process is generally used for boards with high requirements, with good flatness. Generally, sediment is used, and after sedimentation, there is generally no black mat phenomenon. Its flatness and service life are better than those of gold-plated plates.
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