source:Other information release time:2023-07-10 Hits: Popular:PCB Assembly company
Unlike traditional FR-4 (wave fibers), ceramic materials have excellent high-frequency and electrical properties, as well as high thermal conductivity, chemical stability, and thermal stability that organic substrates do not possess. They are ideal packaging materials for the new generation of large-scale integrated circuits and power electronic modules.
1. Higher thermal conductivity
2. More matching thermal expansion coefficient
3. A stronger and lower resistance metal film layer 4. The substrate has good weldability and high usage temperature
5. Good insulation
6. Low high-frequency loss 7. Capable of high-density assembly
8. It does not contain organic components, is resistant to cosmic rays, has high reliability in aerospace, and has a long service life
9. The copper layer does not contain an oxide layer and can be used for a long time in a reducing atmosphere
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