PCB parts falling_Shenzhen StarLight Industrial Development Co., Ltd.

PCB parts falling

source:News release time:2022-11-14 Hits: Popular:PCB Assembly company: Share:

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　　1. Impact or pressure from outside

　　Take the mobile phone as an example, the most likely external stress is the force bending in the pocket (iPhone 6plus bending door event), or the impact caused by accidentally falling on the ground.

　　2. The stress is generated by internal creep

　　For example, when the circuit board or BGA package undergoes reflow deformation at high temperature, the stress will be released until it reaches a balance point, which may also be the time when the solder ball breaks.

　　3. The stress comes from the thermal expansion and cold contraction caused by the change of ambient temperature

　　In some areas, when the product is moved from the indoor heated environment to the outdoor, it will be frozen outdoors in winter; In tropical areas, there is air conditioning indoors, and when you walk from indoors to outdoors, the temperature will change dramatically, not to mention carelessly or intentionally putting the product in the car. The temperature in the sun during the day will rise, and the temperature at night will drop rapidly. The importance of temperature also relates to the different expansion coefficients of different materials. The expansion coefficients of circuit board must be different from that of solder ball, and also different from that of BGA packaging. Just imagine that general roads and bridges will design "expansion joints" to reduce the risk of low thermal expansion and cold contraction of materials, but it seems that electronic materials can only find materials with smaller expansion coefficients.

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