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There is a pair of black things on the PCB circuit board

source:Other information release time:2023-03-01 Hits:     Popular:PCB Assembly company

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  Double Sided PCB

  1. What is COB soft package

  Attentive netizens may find that there will be a black thing on some circuit boards, so what is this? Why does it have any effect on the circuit board? In fact, this is a packaging. We often call it "soft packaging". It is actually for "hard". We usually see that the receiving head receiving surface is also this material. It is the chip IC inside. This process is called "Bang Ding". We usually call it "binding".

  This is a way to play a line process in the chip production process. Its English name is COB (Chip on Board), that is, chip packaging on the board. Put on the PCB printing circuit board, so why do some circuit boards do not have such packaging? What are the characteristics of this packaging?

  2. Cob soft packaging characteristics

  This kind of soft packaging technology is often for cost. As a relatively simple nude chip, in order to protect the internal ICs from damage, this packaging generally requires one -time molding. Generally, it is placed on the PCB circuit board. The shape is round and the color is black. This packaging technology has the advantages of low cost, space saving, light and light, good heat dissipation effect, simple packaging method, etc. Many integrated circuits, especially low cost circuit, only need to be used in this method only in this method. The integrated circuit chip leads to the metal wire, and then placed the chip on the circuit board on the manufacturer, welded with the machine, and then fixed and harden.

  3. Application occasion

  Because of its own unique characteristics, this packaging, in some electronic circuit circuits, such as MP3 player, electronic piano, digital camera, etc., some pursuit of cheap cost circuits also use this packaging.

  In fact, COB soft packaging is not limited to the chip, and it is also widely used in LEDs. For example, COB light source. This is an integrated surface light source technology directly attached to the mirror metal substrate on the LED chip.


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