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How to improve the color difference between the wet film and the back of the text on a PCB circuit board?FR4 Printed Circuit Board Pcb

source:Other information release time:2023-08-17 Hits:     Popular:PCB Assembly company

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  What other effects does the green paint function have besides avoiding oxidation and welding short circuits in the circuit? How to improve the color difference between the wet film and the back of the text on a PCB circuit board? How can the copper surface be kept from oxidation?

  The main functions of green paint are oxidation resistance and welding resistance. In addition, as it is also a dielectric material, it will still have a certain impact on impedance. The problem of color difference on circuit boards is difficult to solve, especially when there are differences in the copper area of the board surface. Due to color differences, it often comes from the color reflection state on the surface of the circuit board. If there is a significant difference in copper area, there is no way to change the actual state, and color difference will definitely exist. Therefore, color difference issues should focus on whether there is discoloration of ink, copper surface, and board that should not occur. Other issues should not be quality important. Of course, some people simply use dark ink to cover up their appearance. As for copper surface oxidation, the surface should be kept dry and continuously maintained after painting and drying, especially before the circuit board is truly dry. Because this type of stack will make residual hot water and gas unable to be discharged, quickly affecting the copper surface and causing oxidation.Solar Energy System

  The general method of making solder stop paint is to first apply ink on one side, then pre dry, and then apply the second side. If the drying time is not very long, the color of the copper surface will not change significantly. But more or less, the surface color will definitely be a bit darker. This kind of problem seems difficult to avoid using existing processes. Therefore, some manufacturers will work separately on both sides of the circuit board, first coating, pre drying, exposing, developing, and hardening one side, and then perform a pre-treatment to make the copper on the other side also present a fresh copper surface, and then perform an overall process. This approach can certainly improve the color problem of the copper surface, but it also affects size control, exposure alignment, flatness of the board surface, and processing costs


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