How many methods are there in PCB thermal stress test?_Shenzhen StarLight Industrial Development Co., Ltd.

How many methods are there in PCB thermal stress test?

source:Other information release time:2023-02-21 Hits: Popular:PCB Assembly company: Share:

　　 Single Sided PCB

　　The thermal stress test adopted by PCB mainly includes two types: heat shock and thermal cycle. There are some different statements and definitions of this method, but the main types are mainly these two types. The main purpose of the thermal impact experiment is to quickly increase the cooling status when assembling the simulation circuit board, and detect the stress effect of rapid temperature changes on the stress of the circuit board. More common testing methods include: drifting tin (floating circuit boards on the tin furnace, simulation wave welding status), soaked oil (also the condition of simulation wave welding, but there is no large amount of tin on the surface, it is easier to perform shortcomings for disadvantages. Observe and analyze), take the tin furnace (simulated SMT assembly back welding status).

　　The main purpose of the thermal cycle experiment is to simulate the changes in the thermal stress impact that the electronics may be subject to during the life cycle, but it is achieved by acceleration methods in the technique. This can test whether the simulation of the circuit board can meet the trust needs of the product's long -term use to ensure its long -term trust. This test will be tested for different grades for different levels of products. IPC, JDEC and other organizations are defined for such testing. There are many types of test simulation methods, such as: high -pressure cooker test (PCT), thermal circulation test (TCT), high -speed stress test (HAST), etc. Because the standard test cycle of standard tests requires more time and time is time -consuming, most product trust tests are quite time -length. Some manufacturers have begun to develop faster testing methods to respond to rapid changes in the world of electronic products. At present, the more typical methods such as high current stress testing (IST) are one of them.

　　In addition to the common standard specifications, some large factories also adjust their test cycles according to the product needs. In this regard, the two parties should clearly follow the determination. However, in the early stage of development of products, most manufacturers will use strict methods to verify materials and products, and the monitoring period of large -scale production will begin to relax to monitoring standards.

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