source:Other information release time:2023-03-14 Hits: Popular:PCB Assembly company
01 —telinking method
For graphics with simple lines, large line width and distance, and irregular deformation, the part of the deformation of the negatives is cut, and the hole position of the drilling test board is re -spliced, and then copied. Simple, width and spacing are larger, and the deformation is irregularly graphics; the negatives with high wire density, wire width and pitch less than 0.2mm are not applicable. Pay attention to hurting the wire as little as possible during the bonding, and do not hurt the pad. When the stitching copy is repaired, pay attention to the correctness of the connection relationship. This method is suitable for negatives that are not dense to the line. The negatives of each layer of negatives are inconsistent. The effect on the welded negatives and multi -layer plate power supply strata, the effect is particularly obvious.
02 —— PCB copy plate changes the hole position method
In the case of the operational technology of digital programmer, first compare the negatives and drilling test boards, measure and write down the length and width of the drilling test board, and then on the digital programmer, according to the length and width of the length and width of the digital programmer, according to its length and width of the width. The size of the deformation, adjust the hole position, and the adjusted drilling test board to cater to the deformation film. The advantage of this method is to avoid the annoying work of the chip and ensure the integrity and accuracy of the graphics. The disadvantage is that the correction of the negatives with uniform deformation and uneven deformation are not effective. To use this method, we must first master the operation of the digital programmer. After using the programmer to put length or shorten the pores, it should be redesigned to the over -the -pore position to ensure accuracy. This method is applicable to dense negatives, or modification of deformation of each layer of negatives.
03 ——The pile overlap method
Put the holes in the test board to overlap the deformed line sheet to ensure the technical requirements of the smallest ring width. After the overlapping copy, the pad is ellipsed. After the overlapping copy, the halo and deformation of the edges of the line and the plate. If the user requirements for the PCB board are very strict, please use it with caution. This method is suitable for negatives with a width and distance of more than 0.30mm, and the graphic line is not too dense.
04 —— illustration method
Just use the camera to enlarge or shrink the deformed graphic. Usually there are more negatives and need to be debugged to obtain a satisfactory circuit graphics. The focus should be accurate when taking pictures to prevent lines from deforming. This method is only applicable to silver -salt chassis. When the inconvenience of drilling the test board, and the deformation ratio of the length and width direction of the film can be used, it can be used.
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