source:Other information release time:2023-06-07 Hits: Popular:PCB Assembly company
In the processing of patch processing, the heat analysis can assist the designer to determine the electrical performance of the component of the PCB line board to help the designer determine whether the component or the PCB line board will burn out due to high temperature. Simple thermal analysis is only to calculate the average temperature of the circuit board, and the complicated ones must establish a transient model on electronic equipment containing multiple circuit boards. The accuracy of thermal analysis finally depends on the accuracy of the component power provided by the lineboard designer.
In many applications, the weight and physical size are very important. If the actual power consumption of the component is small, the safety factor of the design may be too high, so that the design of the line board design is based Perform heat analysis. In contrast (at the same time), the design of thermal safety coefficient is too low, that is, the temperature of the actual operation of the component is higher than the prediction of the analyst prediction. This kind of problem generally needs to be installed with a heat dissipation device or fan to the line board. Cold for solution. These external accessories increase the cost and extend the manufacturing time. Adding a fan in the design will also bring unstable factors to reliability. Therefore, the line board mainly uses active instead of passive cooling (such as natural convection, conduction and radiation Heating).
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