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Description of professional PCB multilayer board pressing process

source:News release time:2022-11-25 Hits:     Popular:PCB Assembly company

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  Metal Core 0.8mm Led Street Light Pcb Aluminium Pcb Board For Led

  1. Autoclave pressure cooker

  It is a container filled with high temperature saturated water vapor and can also apply high pressure. Laminates can be placed in it for a period of time to force water vapor into the circuit board, then take out the board sample and place it on the high temperature molten tin surface to measure its "delamination resistance" characteristics. This word is also synonymous with PressureCook, which is more commonly used in the industry. In addition, there is a "chamber pressure method" that uses high-temperature and high-pressure carbon dioxide in the pressing process of PCB multilayer boards, which also belongs to this type of AutoclavePress.

  2. Cap Lamination

  It refers to the traditional laminating method of early PCB multilayer boards. At that time, the "outer layer" of MLB was overlapped and laminated with thin substrates with single copper skin. Until the output of MLB increased significantly at the end of 1984, the current large or large copper skin pressing method (MssLam) was used. This early MLB pressing method using single-sided copper sheet thin base plate is called CapLamination.

  3. Crease wrinkle

  In the pressing of PCB multilayer boards, it often refers to the wrinkle of copper sheet when it is not handled properly. The thin copper sheet below 0.5oz is easy to have this defect when laminated.

  4. Dent depression

  It refers to the gentle and uniform depression on the copper surface, which may be caused by the local point protrusion of the steel plate used for pressing. If it presents a fault like edge neat descent, it is called DishDown. Such shortcomings, if unfortunately, remain on the line after copper etching, will cause unstable impedance of high-speed transmission signals, resulting in noise. Therefore, this kind of missing shall be avoided on the copper surface of the base plate as far as possible.

  5. CaulPlate

  When PCB multilayer plates are pressed, many "volumes" of bulk materials (such as 8~10 sets) of plates to be pressed are often stacked between each opening of the press, and each set of "bulk materials" (Book) must be separated by a flat, smooth and hard stainless steel plate. The mirror stainless steel plate used for such separation is called CaulPlate or SeparatePlate. At present, AISI430 or AISI630 are commonly used.


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