How many methods are there in PCB thermal stress test?Polymer Film Flex PCB Board Solution_Shenzhen StarLight Industrial Development Co., Ltd.

How many methods are there in PCB thermal stress test?Polymer Film Flex PCB Board Solution

source:Other information release time:2023-06-07 Hits: Popular:PCB Assembly company: Share:

　　The thermal stress test adopted by PCB mainly includes two types: heat shock and thermal cycle. There are some different statements and definitions of such methods, but the main types are mainly these two. The main purpose of the thermal impact experiment is to quickly increase the cooling status when assembling the simulation circuit board, and detect the stress effect on the circuit board's stress on the circuit board. More common testing methods include: drifting tin (floating circuit boards on the tin furnace, simulation wave welding status), soaked oil (also the condition of simulation wave welding, but there is no large amount of tin on the surface, it is easier to perform shortcomings for shortcomings. Observation and analysis), take the tin furnace (the condition of simulation SMT assembly).

　　The main purpose of thermal cycle experiment is to simulate the changes in the thermal stress impact that the electronics may be subject to during the life cycle, but it is only achieved by acceleration methods in the technique. In this way, it can test whether the simulated circuit board can meet the trust needs of the long -term use of the product to ensure its long -term trust. This test will be tested for different levels of products for different levels of products. IPC, JDEC and other organizations all define such tests. There are many types of test simulation methods, such as: high -pressure cooker test (PCT), thermal circulation test (TCT), high -speed stress test (HAST), etc. Because the standard test cycle of standard tests requires more time and time is time -consuming, most product trust tests are quite time -length. Some manufacturers have begun to develop faster testing methods to respond to rapid changes in the world of electronic products. The current typical methods such as high current stress testing (IST) are one of them.

　　In addition to the common standard specifications, some large factories also adjust their test cycle according to the product needs. In this regard, the two parties should clearly follow the determination. However, in the early stage of development of products, most manufacturers will use strict methods to verify materials and products, and the monitoring period of large -scale production will begin to relax to monitoring standards.

Read recommendations:

Lightweight Aluminum PCB Board Green Solder Mask Led Light Pcb Board 3.0mm

PCB Assembly

HASL FR4 Single Sided Copper PCB Board White Solder Mask 35um Thickness