source:News release time:2024-01-02 Hits: Popular:PCB Assembly company
Electroplating is a process that uses the principle of electrolysis to plate a thin layer of other metals or alloys on certain metal surfaces. It is a process that uses electrolysis to attach a metal film to the surface of metal or other material parts to prevent metal oxidation ( Such as rust), improve wear resistance, conductivity, reflectivity, corrosion resistance (copper sulfate, etc.) and enhance aesthetics. The outer layer of many coins is also electroplated.
Our country's economy has continued to grow rapidly, and the center of the world's manufacturing and processing industries is shifting to our country. Electroplating technology not only plays an important role in traditional industries; it also plays an important role in high-tech industries, such as modern electronic technology, microelectronics technology, communication technology and products play an increasingly important role in manufacturing. As a centralized base for electroplating processing, Shenzhen has been at the forefront of development in this field, especially in the field of PCB electroplating. Below we will briefly discuss the impact and development of acid copper plating on the PCB electroplating industry in Shenzhen.
Copper sulfate electroplating plays an extremely important role in PCB electroplating. The quality of acid copper plating directly affects the quality and related mechanical properties of the electroplated copper layer, and has a certain impact on subsequent processing. Therefore, how to choose high-quality high-purity copper sulfate and Controlling the quality of acid copper plating procedures is an important part of PCB plating.
In the electronic circuit board manufacturing industry, the acid copper plating process is used to thicken the electroless copper layer. Since circuit board electroplating requires extremely high quality and excellent dispersion ability, it is extremely sensitive to various metal impurities (such as iron, zinc, lead, tin, antimony, etc.) and organic impurities in the plating solution. As the main salt in the acidic copper sulfate plating solution, the quality of copper sulfate must be fully guaranteed, and materials of electroplating grade or above are usually used. The function of copper sulfate is to ionize copper ions in the aqueous solution, and the copper ions obtain electrons on the cathode to deposit a copper coating. The use of high-purity refined copper sulfate can prevent various metal impurities and organic impurities from being exhausted into the plating solution to the greatest extent, thereby effectively preventing pinholes, grit, blackening, fogging and other failures in the plating layer, ensuring that the electroplating process is The uniformity of the plate thickness distribution and the ability to deep-plat deep holes and small holes can help improve the physical properties of the coating such as ductility and tensile strength.
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