What is the difference between ceramic substrate and ordinary PCB board?multilayer printed circuit board analysis_Shenzhen StarLight Industrial Development Co., Ltd.

What is the difference between ceramic substrate and ordinary PCB board?multilayer printed circuit board analysis

source:Other information release time:2023-09-04 Hits: Popular:PCB Assembly company: Share:

　　Ceramic substrate is a type of special PCB board with excellent thermal conductivity, insulation performance, and high dielectric constant. It is widely used as a terminal product in the field of heat dissipation. So, what is the difference between ceramic substrates and ordinary PCB boards?

　　1、 The difference between ceramic substrate and PCB board

　　1. The materials are different. Ceramic substrates are inorganic materials, with the core being aluminum trioxide or aluminum nitride; The ordinary PCB board uses FR4 fiberglass board, which is an organic material. Ceramic substrates are fragile and cannot be pressed together, while ordinary PCB boards can be pressed together in multiple layers.

　　2. The performance and application of ceramic substrates are different.

　　Ceramic substrates are used in industries with high demand for heat dissipation, such as high-power LED lighting, high-power modules, high-frequency communication, rail power supply, etc; Ordinary PCB boards are widely used, mostly in private commercial goods.

　　2、 Differences between ceramic substrates and high-frequency boards

　　1. Different materials. The ceramic substrate is made of aluminum trioxide or aluminum nitride, while the high-frequency board is mostly made of Rogers, Yaron, polytetrafluoroethylene, etc., with low dielectric constant and fast high-frequency communication speed.

　　2. Different performance. Ceramic substrates are widely used in fields such as refrigeration chips and systems, high-power modules, and automotive electronics. High frequency boards are mainly used in the field of high-frequency communication, aviation, high-end consumer electronics, etc.

　　3. The field of high-frequency communication involves heat dissipation needs, usually requiring a combination of ceramic substrate and high-frequency board, such as high-frequency ceramic PCB.

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