source:News release time:2023-02-21 Hits: Popular:PCB Assembly company
In many applications, the weight and physical size are very important. If the actual power consumption of the component is small, the safety factor of the design may be too high, so that the design of the line board design is not consistent with the actual or too conservative component power value as the basis Perform heat analysis.
Under normal circumstances, the distribution of copper foil on the PCB line board is very complicated and difficult to model accurately. Therefore, the shape of the wiring needs to be simplified during modeling, and the electronic components on the ANSYS model line board that are close to the actual circuit board can also be used to simplify the modeling to simulate, such as MOS tubes, integrated circuit blocks, etc.
Heat analysis
In the processing of patch processing, the heat analysis can assist the designer to determine the electrical performance of the component of the PCB line board to help the designer determine whether the component or the PCB line board will burn out due to high temperature. Simple thermal analysis is only to calculate the average temperature of the circuit board, and the complex ones must establish a transient model for electronic devices containing multiple circuit boards. The accuracy of thermal analysis finally depends on the accuracy of the component power provided by the lineboard designer.
In many applications, the weight and physical size are very important. If the actual power consumption of the component is small, the safety factor of the design may be too high, so that the design of the line board design is not consistent with the actual or too conservative component power value as the basis Perform heat analysis. In contrast (at the same time), the design of thermal safety coefficient is too low, that is, the temperature of the temperature at the actual operation of the component is higher than the analyst prediction. This problem generally needs Cold for solution. These external accessories increase the cost and extend the manufacturing time. Adding a fan in the design will also bring unstable factors to reliability. Therefore, the line board mainly uses active type rather than passive cooling methods (such as natural convection, conduction and radiation Heating).
Simplified modeling
What are the main thermal devices in the circuit board before modeling, such as MOS tube and integrated circuit blocks, etc. These components turn most of the loss power into heat at work. Therefore, these devices are mainly considered when modeling.
In addition, it is necessary to consider the copper foil coated on the line board. They not only play a role in conductive in the design, but also to conduct heat. The heat conductivity and heat transfer area are relatively large. The line board is an indispensable part of the electronic circuit. It is composed of copper foil coated as a wire. The thickness of the epoxy resin substrate is 4mm, and the thickness of the copper foil is 0.1mm. The heating rate of copper is 400W/(m ℃), while the thermal conductivity of epoxy resin is 0.276W/(m ℃). Although the copper foil added is thin and thin, it has a strong guidance effect on calories, so it cannot be ignored in modeling.
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