source:News release time:2022-09-17 Hits: Popular:PCB Assembly company
Board surface blistering is one of the more common quality defects in the production process of PCB boards. Due to the complexity of the PCB board production process, it is difficult to prevent board surface blistering defects. So, what are the reasons for the blistering of the PCB surface?
1. The problem of substrate processing. For some thinner substrates, because the rigidity of the substrate is poor, it is not suitable to use a brushing machine to brush the board. Therefore, attention should be paid to control during production and processing to avoid poor bonding between the copper foil and chemical copper of the board substrate. Foaming on the board.
2. Oil stains on the board surface during machining (drilling, lamination, milling, etc.), or other liquids contaminate the surface with dust, which will cause the board surface to foam.
3. Defective copper sinking brush board. The pressure of the pre-copper immersion grinding plate is too large, which will cause the orifice to deform, which will cause the orifice to foam during the process of copper immersion electroplating, tin spray welding, etc.
4. Washing problem. Because immersion copper electroplating has to undergo a lot of chemical treatment, there are many kinds of acid, alkali, inorganic, organic and other chemical solvents, which will not only cause cross-contamination, but also cause poor local treatment of the board surface, resulting in some bonding problems.
5. Micro-etching in pre-treatment of copper immersion and pattern plating. Excessive micro-etching will cause the orifice to leak the substrate and cause foaming around the orifice.
6. The activity of the copper precipitation solution is too strong. The content of the three components in the newly opened copper precipitation liquid or the tank liquid is too high, resulting in the deterioration of the physical properties and quality of the coating and the defects of poor adhesion.
7. Oxidation of the board surface during the production process will also cause the board surface to blister.
8. Poor copper rework. During the rework process of some immersion copper rework boards, due to poor de-plating, incorrect rework method or improper control of micro-etching time during the rework process, the board surface will foam.
9. Insufficient water washing after development during graphic transfer, too long storage time after development or too much dust in the workshop, etc., will cause potential quality problems.
10. The pickling tank should be replaced in time before copper plating, otherwise it will not only cause problems with the cleanliness of the board surface, but also cause defects such as roughness of the board surface.
11. Organic contamination in the electroplating tank, especially oil contamination, will cause blistering on the board surface.
12. Special attention should be paid to the charging tank of the board during the production process, especially the plating tank with air agitation.
The above is the analysis of the causes of blistering on the surface of the PCB board, I hope it will be helpful to the peers in the industry! In the actual production process, there are still many reasons for the blistering of the board surface. It is necessary to analyze the specific situation and cannot generalize.
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