source:News release time:2023-06-21 Hits: Popular:PCB Assembly company
Symptom: During the immersion welding process, the solder pad and wire detach.
Inspection method: During the incoming inspection, conduct sufficient testing and carefully control all wet processing processes.
Possible reasons:
During the processing, detachment of solder pads or wires may be caused by electroplating solution, solvent corrosion, or copper stress during electroplating operations.
2. Punching, drilling, or piercing can cause partial detachment of the solder pad, which becomes apparent during hole metallization operations.
During wave soldering or manual soldering operations, detachment of solder pads or wires is usually caused by improper soldering techniques or excessively high temperatures. Sometimes, due to poor adhesion or low thermal peel strength of the laminate, the bonding pad or wire may detach.
Sometimes the design and wiring of printed boards can cause solder pads or wires to detach in the same place.
During the soldering operation, the retained absorption heat of the components can cause the solder pad to detach.
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